Семейство
Plated through holes (PTH) Surface chemical Ni/Au with solder stop mask Технические параметры
- Housing size: TSSOP24, SSOP24 (1.27 mm)
- Material type: FR4 Epoxide + chem. Au
- Dimensions L x W: 31.75 x 19.05 mm
- Copper lamination: 35 µm double sided; plated through
- Pitch/mm: 2.54
- Hole ø/mm: 1.1
- Board thickness/mm: 1.5
- No. of pins: 24