Семейство
Plated through holes (PTH) Surface chemical Ni/Au with solder stop mask Hole ; 1.1 mm with solder pads ; 2.1 mm Shield pad and cooling field Технические параметры
- Housing size: HSSOP8 (0.8 mm)
- Material type: FR4 Epoxide + chem. Au
- Dimensions L x W: 15.88 x 13.97 mm
- Copper lamination: 35 µm double sided; plated through
- Pitch/mm: 2.54
- Hole ø/mm: 1.1
- Board thickness/mm: 1.5
- No. of pins: 8